SK hynix to Unveil ‘Full Stack AI Memory Provider’ Vision at CES 2025

SK hynix Inc. announced today that it will showcase its innovative AI memory technologies at CES 2025, to be held in Las Vegas from 7 to 10 January (local time).

A large number of C-level executives, including CEO Kwak No-jung, CMO (Chief Marketing Officer) Justin Kim, and Chief Development Officer (CDO) Ahn Hyun, will attend the event. “We will broadly introduce solutions optimised for on-device AI and next-generation AI memories, as well as representative AI memory products such as HBM and eSSD at this CES,” said Justin Kim. “Through this, we will publicise our technological competitiveness to prepare for the future as a ‘Full Stack AI Memory Provider.'”

SK hynix will also run a joint exhibition booth with SK Telecom, SKC, and SK Enmove, under the theme “Innovative AI, Sustainable Tomorrow.” The booth will showcase how SK Group’s AI infrastructure and services are transforming the world, represented in waves of light.

SK hynix, which is the world’s first to produce 12-layer HBM products for the 5th generation and supply them to customers, will showcase samples of HBM3E 16-layer products, officially developed in November last year. This product uses the advanced MR-MUF process to achieve the industry’s highest 16-layer configuration while controlling chip warpage and maximising heat dissipation performance.

In addition, the company will display high-capacity, high-performance enterprise SSD products, including the ‘D5-P5336’ 122TB model developed by its subsidiary Solidigm in November last year. This product, with the largest existing capacity, high power, and space efficiency, has been attracting considerable interest from AI data centre customers.

“As SK hynix succeeded in developing QLC (Quadruple Level Cell)-based 61TB products in December, we expect to maximise synergy based on a balanced portfolio between the two companies in the high-capacity eSSD market,” said Ahn Hyun, CDO at SK hynix. The company will also showcase on-device AI products such as ‘LPCAMM2’ and ‘ZUFS 4.0,’ which improve data processing speed and power efficiency to implement AI in edge devices like PCs and smartphones. The company will also present CXL and PIM (Processing in Memory) technologies, along with modularised versions, CMM (CXL Memory Module)-Ax and AiMX, designed to be core infrastructures for next-generation data centres.

In particular, CMM-Ax is a groundbreaking product that adds computational functionality to CXL’s advantage of expanding high-capacity memory, contributing to improving performance and energy efficiency of next-generation server platforms.

“The changes in the world triggered by AI are expected to accelerate further this year, and SK hynix will produce 6th generation HBM (HBM4) in the second half of this year to lead the customised HBM market to meet the diverse needs of customers,” said Kwak Noh-Jung, CEO at SK hynix. “We will continue to do our best to present new possibilities in the AI era through technological innovation and provide irreplaceable value to our customers.”